you have practical, working tsmc chips plus next-gen r&d versus theoretical chips from Intel, a company that has not fared well over 30 years of trying to catch up with TSMC.
Intel has only been behind for the last 7 years or so, because they were several years delayed in rolling out their 10nm node. Before 14nm, Intel was always about about 3 years ahead of TSMC. Intel got leapfrogged at that stage because it struggled to implement the finFET technology that is necessary for progressing beyond 14nm.
The forward progress of semiconductor manufacturing tech isn’t an inevitable march towards improvement. Each generation presents new challenges, and some of them are quite significant.
In the near future, the challenge is in certain three dimensional gate structures more complicated than finFET (known as Gate All Around FETs) and in backside power delivery. TSMC has decided to delay introducing those techniques because of the complexity and challenges while they squeeze out a few more generations, but it remains to be seen whether they’ll hit a wall where Samsung and/or Intel leapfrog them again. Or maybe Samsung or Intel hit a wall and fall even further behind. Either way, we’re not yet at a stage where we know what things look like beyond 2nm, so there’s still active competition for that future market.
Edit: this is a pretty good description of the engineering challenges facing the semiconductor industry next:
If you’re referring to the 13&14th Gen chips then yes, Intel is saying it’s on the software side.
But if you’re talking about 10th Gen chips that took forever to get out of the gate due to issues with sub 14nm lithography, then no it’s a hardware issue. Intel has had issues over recent years with actual die shrinks.
Regardless, it feels like what we see with Boeing. A company culture that prioritized marketing and time to market over everything else consequences be damned.
Move fast and break stuff is probably not the best strategy if you are building airplanes or processors or other PhD level stuff… Or maybe it’s just never a good strategy.
Yeah nice fast and break things is a great way to maximize short term profits at the expense of the long term. But fuck it, I got mine in the short term, so it works.
If you’re referring to the 13&14th Gen chips then yes, Intel is saying it’s on the software side.
Yes, I was, but there was also some initial manufacturing issue with oxidation. That wasn’t the bulk of the issues that they were running into, though.
you have practical, working tsmc chips plus next-gen r&d versus theoretical chips from Intel, a company that has not fared well over 30 years of trying to catch up with TSMC.
they’re not worried yet.
Intel has only been behind for the last 7 years or so, because they were several years delayed in rolling out their 10nm node. Before 14nm, Intel was always about about 3 years ahead of TSMC. Intel got leapfrogged at that stage because it struggled to implement the finFET technology that is necessary for progressing beyond 14nm.
The forward progress of semiconductor manufacturing tech isn’t an inevitable march towards improvement. Each generation presents new challenges, and some of them are quite significant.
In the near future, the challenge is in certain three dimensional gate structures more complicated than finFET (known as Gate All Around FETs) and in backside power delivery. TSMC has decided to delay introducing those techniques because of the complexity and challenges while they squeeze out a few more generations, but it remains to be seen whether they’ll hit a wall where Samsung and/or Intel leapfrog them again. Or maybe Samsung or Intel hit a wall and fall even further behind. Either way, we’re not yet at a stage where we know what things look like beyond 2nm, so there’s still active competition for that future market.
Edit: this is a pretty good description of the engineering challenges facing the semiconductor industry next:
https://www.semianalysis.com/p/clash-of-the-foundries
And with the issues intel had with their processors…
It does sound like most of that was not actually manufacturing, but design.
If you’re referring to the 13&14th Gen chips then yes, Intel is saying it’s on the software side.
But if you’re talking about 10th Gen chips that took forever to get out of the gate due to issues with sub 14nm lithography, then no it’s a hardware issue. Intel has had issues over recent years with actual die shrinks.
Regardless, it feels like what we see with Boeing. A company culture that prioritized marketing and time to market over everything else consequences be damned.
Move fast and break stuff is probably not the best strategy if you are building airplanes or processors or other PhD level stuff… Or maybe it’s just never a good strategy.
Yeah nice fast and break things is a great way to maximize short term profits at the expense of the long term. But fuck it, I got mine in the short term, so it works.
Yes, I was, but there was also some initial manufacturing issue with oxidation. That wasn’t the bulk of the issues that they were running into, though.